Logic semiconductor manufacturers plan to replace FinFET devices with Gate All Around at sub-3nm nodes. Applied Materials has introduced a complex seven chamber system with Atomic Layer Deposition as ...

Copper’s resistivity depends on its crystal structure, void volume, grain boundaries and material interface mismatch, which becomes more significant at smaller scales. The formation of copper (Cu) ...

The Global Semiconductor Etch Equipment Market revenue was USD 22730 Million in 2022 and is forecast to a readjusted size of ...

Semiconductors are a crucial element of electronic equipment, allowing for advancements in telecommunications, computers, biotechnology, weapons technology, aviation, renewable energy, and a variety ...

Focuslight Technologies Inc., a photonics application solution provider, has announced Flux H Series - a variable beam laser system for pan-semiconductor manufacturing processes. The application of ...

Released every 12 to 18 months, 3D NAND scaling outpaces most other semiconductor devices in replacement rate and performance ...

New Portfolio Leapfrogs the Competition with Innovative Etch Techniques and Chemistries to Support Development of Advanced Logic and Memory Solutions As modern technologies and devices continue to ...

Silicon nitride etch has been one of the foundations of semiconductor manufacturing for a number of years. Overall silicon (Si) etch rate is dictated by the combination of process temperature and H 2 ...

TOKYO, Sept 16, 2025 - (JCN Newswire) - - JSR Corporation, a leading technology company focused on material innovation and the parent company of Inpria Corporation, a metal oxide photoresist solution ...

In circuitry, etching is used to remove the deformed layer created during the grinding and polishing of metal components by selective chemical attack. Now, a research group at Nagoya University in ...

Achieves Damage-Free Atomic-Level Etching with a Wide Range of Optional Functions TOKYO--(BUSINESS WIRE)--Hitachi High-Technologies Corporation (TSE: 8036) (Hitachi High-Tech) announced the ...

Companies to Focus on Patterning for Leading-Edge Chips, Including Dry Resist EUV Lithography and Next-Generation Materials Lam, JSR agreement intended to drive the industry's transition to next-gen ...