“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...
The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...
The market for Compute Express Link (CXL) products will enjoy rapid growth to nearly $3.4 billion by 2028 as servers come to market with the technology. That’s the conclusion of a new report from ...
NVIDIA is expanding its CPU design efforts in with the introduction of its Grace CPU Superchip, its first discrete data center CPU for high performance computing (HPC) workloads. It's actually two ...
PCquest.com on MSN
AI broke the old chip playbook. AMD is writing a new one
AI is reshaping chips fast. See how AMD is rethinking chiplets, CPUs, GPUs, and interconnects to power devices and data ...
Rapid increases in machine-generated data are fueling demand for higher-performance multi-core computing, forcing design teams to rethink the movement of data on-chip, off-chip, and between chips in a ...
Intel says its work on switching from copper I/O to optical fiber has taken a big step forward in high-speed data transmission. At this year's Optical Fiber Communication Conference in San Francisco, ...
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