“The main motivation of this review is to study the evolution of first and second level of interconnect materials used in memory device semiconductor packaging. Evolutions of bonding wires from gold ...
The PCI-Express standards-setting organization is creating a thin interconnect that would link mobile devices such as smartphones and tablets to external peripherals, the organization’s chief said on ...
The market for Compute Express Link (CXL) products will enjoy rapid growth to nearly $3.4 billion by 2028 as servers come to market with the technology. That’s the conclusion of a new report from ...
NVIDIA is expanding its CPU design efforts in with the introduction of its Grace CPU Superchip, its first discrete data center CPU for high performance computing (HPC) workloads. It's actually two ...
A new technical paper titled “Rethinking Programmed I/O for Fast Devices, Cheap Cores, and Coherent Interconnects” was published by researchers at ETH Zurich. “Conventional wisdom holds that an ...
AI is reshaping chips fast. See how AMD is rethinking chiplets, CPUs, GPUs, and interconnects to power devices and data ...
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