The GPU made its debut at CES alongside five other data center chips. Customers can deploy them together in a rack called the Vera Rubin NVL72 that Nvidia says ships with 220 trillion transistors, ...
The big drivers of 5G mobile network adoption are higher bandwidth, lower latency and higher reliability. For 5G chipmakers, this translates into a need for 5G chips and modules with higher efficiency ...
Quectel Wireless Solutions, an end-to-end global IoT solutions provider, today announces the launch of a new-generation smart robotic computing module, the SH602HA-AP. Based on the D-Robotics Sunrise ...
5G chipmakers have placed a lot of attention on supporting new 5G technologies, including 5G-Advanced, satellite non-terrestrial network (NTN) connectivity, 5G fixed wireless access (FWA), and 5G Open ...
Why co-packaged optics (CPO) are needed in high-performance computing (HPC). How IBM delivers CPO. What CPO means for HPC applications like artificial intelligence and machine learning. Providing high ...
With the explosive increase in demand for artificial intelligence (AI), autonomous driving, Internet of Things (IoT), data centers, augmented reality and virtual reality (AR/VR), the market of ...
The growth of AI and machine learning applications has necessitated the development of high-performance interconnection solutions between large ASICs and linear optical modules. To meet these ...
TL;DR: Apple's iPhone 18 will feature the next-gen A20 chip using TSMC's advanced WMCM packaging with MUF technology, enhancing efficiency and yield. Eternal secured a major contract as a packaging ...
ByteDance plans to spend approximately $14.3 billion on NVIDIA AI chips in 2026. The plan supports increased AI computing for ...
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