The semiconductor shortage has curtailed the choices available to designers and caused some inventive solutions to be found, but the one used by [djzc] is probably the most inventive we’ve yet seen.

Dublin, July 29, 2025 (GLOBE NEWSWIRE) -- The "eFuse Market by Type, Packaging Type, Application, Vertical, and Region - Global Forecast to 2030" has been added to ResearchAndMarkets.com's offering.

[youtube=http://www.youtube.com/v/c_Qt5CtUlqY&hl=en_US&fs=1&] Take a few minutes to watch this amazingly informative video on how to solder QFN or MLF components ...

One of the most cutting-edge packaging technologies to recently emerge in the electronics marketplace is the quad flat no leads (QFN)-type package. It serves as an alternative to the more costly ...

MicroLeadFrame (MLF)/ quad flat no-lead (QFN) packaging technology is the fastest growing IC packaging solution today. From a market segment perspective, MLF packaging solutions represent more than a ...

QFN bad soldering is often happening in SMT assemble, consider from many aspects, such as pad design, PCB storage, chip control and management, solder paste management and use, furnace temperature ...

Intelligent power module (IPM) in a high efficiency, ultra-compact, highly integrated QFN package saves energy when driving motors up to 200W. With over 200 million motors produced every year with ...

UTAC Holdings, a Singapore-based semiconductor testing and assembly services provider, has introduced two new offerings to bolster its quad flat no-lead (QFN) portfolio - a 0.3mm thin QFN package and ...

Momentum is building for IC packages based on an emerging technology called molded interconnect substrate (MIS). ASE, Carsem, JCET/STATS ChipPAC, Unisem and others are developing IC packages based on ...