Ottawa, Nov. 14, 2025 (GLOBE NEWSWIRE) -- The global organic substrate packaging materials market stood at USD 17.40 billion in 2025 and is projected to reach USD 28.41 billion by 2034, according to a ...
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Korean firms expand AI substrate production amid shortages
The boom in investments in artificial intelligence (AI) data centers continues to drive explosive growth in the ...
DELRAY BEACH, Fla., Oct. 31, 2025 /PRNewswire/ -- The MEMS packaging substrate market is expected to grow from USD 2.40 billion in 2025 to USD 3.23 billion by 2030, at a CAGR of 6.1% according to a ...
However, packaging capacity has lagged, and semiconductor manufacturers still need to ship their advanced chips overseas to ...
Chipmakers are turning to glass substrates for AI packages, enabling larger and denser arrangements of chiplets and ...
While semiconductor lithography gets the bulk of the attention in chipmaking, other processes are equally important in producing working integrated circuits (ICs). Case in point: packaging. An IC ...
The rapid development of AI has dramatically increased demand for AI chips, but current organic substrate technology faces challenges, including thermal expansion mismatches and warping, which ...
As hardware demands for artificial intelligence continue to surge, beyond increased size and complexity in chip packaging, ...
Rapidus, which positions itself as a vertically integrated chipmaker that offers both front-end semiconductor production and back-end packaging, plans to discuss its efforts in the field of ...
CARROLLTON, Tex. — A spin-off of Amkor Technology Inc. in Texas is quietly developing and producing a new class of substrates that could accelerate the development of true system-in-packaging (SIP) ...
Provides non-destructive 3D analysis of the location, morphology, and depth profile of internal defects in glass substrates Introduces TAMI, a dedicated 3D analysis software platform that connects R&D ...
AUSTIN, Texas--(BUSINESS WIRE)--3M Electronics Materials Solutions Division today announced the launch of its new 3M™ LED Chip Packaging Substrate that provides a cost-effective alternative to ceramic ...
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