After more than a decade of research and development, Tokyo Electron Miyagi Ltd. has introduced an innovative semiconductor ...
Date Announced: 29 Nov 2011 Fremont, CA - MicroTech has developed a wet process station for the etching of PSS (Patterned Sapphire Substrate) wafers used to increase light extraction and efficiency in ...
HORSHAM, PA--(Marketwired - Jul 8, 2013) - Today at SEMICON West, Solid State Equipment LLC (DBA SSEC), a leading provider of single wafer wet processing systems used in the manufacture of ...
FREMONT, Calif., July 24, 2025 (GLOBE NEWSWIRE) -- ACM Research, Inc. (“ACM”) (NASDAQ: ACMR), a leading supplier of wafer and panel processing solutions for semiconductor and advanced packaging ...
This shipment marks MEI's entrance into the Taiwanese market. This Advanced Etch wet bench will be used for Copper etch and Titanium etch wet chemical processing of 200 mm compound semiconductor or ...
Through silicon via (TSV) technology is a key design element being incorporated into more and more advanced packaging designs today. TSVs offer distinct benefits in form factor and improved ...
Whether Samsung still uses this particular apparatus is unknown, but vacuum chambers are necessary during the dry etching process due to the plasma. Types of etching Samsung describes wet etching as ...