DNP has taken advantage of our microfabrication technology developed over many years to successfully achieve the configuration of lead frame silver plated area of ±25um. It has also been possible to ...

This family of lead-frame packages has been extended to include dual-sided units. Said to combine the performance of array packages with the lower cost of lead frames, the dual, fine-pitch, no-lead ...

Dai Nippon Printing Co (DNP) has developed a new lead frame in response to efforts to slim down the semiconductor package mounted on electronic devices, including mobile terminals and PCs. Using this ...

Advanced Interconnect Technologies Inc. (AIT) has announced two new versions of its lead-frame package family that the company claims combine the best attributes not only of lead-frame but of array ...

Pune,India, Feb. 16, 2023 (GLOBE NEWSWIRE) -- The global Semiconductor Lead Frame Market Size was assessed at USD 3.18 billion in 2021. The market is slated to expand from USD 3.33 billion in 2022 to ...

Report Ocean has released a market research report on the Semiconductor Lead Frame Market, covering 150+ countries and analyzing over 1,00000 published and forthcoming reports per year. The report, ...

Australian technology firm Lednium has developed a domed lead-frame package to improve light distribution in LED lighting. “It is a natural progression when creating a source of Illumination from what ...

CSP, driven by end-customer demand for portable handheld products, is exploding in use across the IC packaging industry. But the most utilized CSP package style emerging for 8-64 lead-count devices is ...

TOKYO--(BUSINESS WIRE)--Dai Nippon Printing Co., Ltd. (DNP, TOKYO: 7912) has developed a highly reliable manufacturing technology that configures a high definition silver plated area for lead frames ...